iplusmile Non-Stick Bread Loaf Pan with Lid, 100x100mm Toast Baking Mold, Kitchen Loaf Tin for Oven Cooking and Bread Preservation

£15.59 (as of 04/29/2026 18:09 PST - DetailsProduct prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply to the purchase of this product.)

Engineered to endure high temperatures, compatible with diverse baking tools, catering to the needs of both novices and expert bakers, ideal for bread baking and DIY loaf moulding.

SKU: B0GGZM7HDC Category: Tags: , , , , Brand:

Description

  • Heat Resistance: engineered to endure high temperatures, compatible with diverse baking tools, catering to the needs of both novices and expert bakers, ideal for bread baking and DIY loaf moulding.
  • Versatile Baking Tool: perfect for crafting a selection of breads and cakes, this pan enhances your everyday baking experience, including bread loaf pans and nonstick cake mould.
  • Convenient Lid Design: features a snug-fitting lid to maintain freshness, making it ideal for storing baked goods or transporting them easily, suitable for a baking bread pan and toast mould.
  • Compatibility: designed to excel in various baking environments, offering versatility for different recipes and techniques, including a bread baking pan with lid and sourdough loaf pan.
  • Baking: the nonstick coating ensures easy release and cleanup, allowing you to focus on the joy of baking, making it a non-stick loaf pan and toast pan.

Additional information

Manufacturer

iplusmile

Product Group

Kitchen

Part Number

ZYK39SUYEO23YP1J16Y

Model

ZYK39SUYEO23YP1J16Y

Color

Gold

Product Dimensions

3.94 x 3.94 x 3.82 inches

Item Weight

0.72 pounds

Size

10.00X10.00X9.70CM

Reviews

There are no reviews yet.

Be the first to review “iplusmile Non-Stick Bread Loaf Pan with Lid, 100x100mm Toast Baking Mold, Kitchen Loaf Tin for Oven Cooking and Bread Preservation”

Your email address will not be published. Required fields are marked *